Assignee
WU PAUL YING-FUNG
US·3 granted patents·33 citations·filing 2006–2021
Top patents by PatentIndex Score
3 records- 0184US8198724B1Integrated circuit device having a multi-layer substrate and a method of enabling signals to be routed in a multi-layer substrateWU PAUL YING-FUNG·Filed 2008·Granted Jun 12, 2012·24 cites·19 claims
- 0280US8395903B1Interconnect pattern for semiconductor packagingWU PAUL YING-FUNG·Filed 2006·Granted Mar 12, 2013·9 cites·5 claims
- 0352US12255880B2Cryptographic device, system and method thereofWU PAUL YING FUNG·Filed 2021·Granted Mar 18, 2025·0 cites·3 claims
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