Assignee
WU SHANG-YI
TW·3 granted patents·3 pending applications·7 citations·filing 2010–2011
Top patents by PatentIndex Score
6 records- 0173US8866268B2Semiconductor package structure and manufacturing method thereofWU SHANG-YI·Filed 2011·Granted Oct 21, 2014·4 cites·20 claims
- 0267US8558262B2High-reflection submount for light-emitting diode package and fabrication method thereofWU SHANG-YI·Filed 2011·Granted Oct 15, 2013·2 cites·7 claims
- 0357US8174044B2Light emitting diode package and method for forming the sameWU SHANG-YI·Filed 2010·Granted May 8, 2012·1 cites·20 claims
- 0439US2011284887A1Light emitting chip package and method for forming the sameWU SHANG-YI·Filed 2010·Application pending·0 cites
- 0539US2011303936A1Light emitting device package structure and fabricating method thereofWU SHANG-YI·Filed 2010·Application pending·0 cites
- 0636US2011170303A1Chip package and fabrication method thereofWU SHANG-YI·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →