Assignee

WU SHENG-YU

TW·2 granted patents·13 citations·filing 2011–2011

Technology mixH10W2 H01L1 Y02P1

Top patents by PatentIndex Score

2 records

0187US8912649B2Dummy flip chip bumps for reducing stressWU SHENG-YU·Filed 2011·Granted Dec 16, 2014·7 cites·16 claims
0281US8598691B2Semiconductor devices and methods of manufacturing and packaging thereofWU SHENG-YU·Filed 2011·Granted Dec 3, 2013·6 cites·20 claims

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