Assignee
WU WENG-JIN
TW·6 granted patents·3 pending applications·35 citations·filing 2006–2011
Top patents by PatentIndex Score
9 records- 0194US8581418B2Multi-die stacking using bumps with different sizesWU WENG-JIN·Filed 2010·Granted Nov 12, 2013·17 cites·20 claims
- 0281US8736039B2Stacked structures and methods of forming stacked structuresWU WENG-JIN·Filed 2006·Granted May 27, 2014·9 cites·17 claims
- 0379US8058150B2Particle free wafer separationWU WENG-JIN·Filed 2008·Granted Nov 15, 2011·6 cites·20 claims
- 0468US8664749B2Component stacking using pre-formed adhesive filmsWU WENG-JIN·Filed 2011·Granted Mar 4, 2014·2 cites·20 claims
- 0562US8432038B2Through-silicon via structure and a process for forming the sameWU WENG-JIN·Filed 2010·Granted Apr 30, 2013·1 cites·14 claims
- 0646US2009289097A1Wafer Leveling-Bonding System Using Disposable FoilsWU WENG-JIN·Filed 2008·Application pending·0 cites
- 0745US2009008794A1Thickness Indicators for Wafer ThinningWU WENG-JIN·Filed 2007·Application pending·0 cites
- 0845US2008191310A1By-product removal for wafer bonding processWU WENG-JIN·Filed 2007·Application pending·0 cites
- 0941US9117828B2Method of handling a thin waferWU WENG-JIN·Filed 2010·Granted Aug 25, 2015·0 cites·20 claims
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