Assignee
WU YI-WEN
TW·5 granted patents·1 pending application·41 citations·filing 2010–2012
Top patents by PatentIndex Score
6 records- 0196US8441124B2Cu pillar bump with non-metal sidewall protection structureWU YI-WEN·Filed 2010·Granted May 14, 2013·25 cites·20 claims
- 0287US9099396B2Post-passivation interconnect structure and method of forming the sameWU YI-WEN·Filed 2011·Granted Aug 4, 2015·8 cites·20 claims
- 0377US8823167B2Copper pillar bump with non-metal sidewall protection structure and method of making the sameWU YI-WEN·Filed 2012·Granted Sep 2, 2014·3 cites·20 claims
- 0472US8865586B2UBM formation for integrated circuitsWU YI-WEN·Filed 2012·Granted Oct 21, 2014·3 cites·20 claims
- 0569US8937388B2Methods and apparatus of packaging semiconductor devicesWU YI-WEN·Filed 2012·Granted Jan 20, 2015·2 cites·20 claims
- 0638US2012098124A1Semiconductor device having under-bump metallization (ubm) structure and method of forming the sameWU YI-WEN·Filed 2011·Application pending·0 cites
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