Assignee
XINTEC INC
TW188 patents
Top patents by PatentIndex Score
US10109559B2Oct 23, 2018
Electronic device package and fabrication method thereof
XINTEC INC29 citations94
US8741683B2Jun 3, 2014
Chip package and fabrication method thereof
XINTEC INC24 citations92
US8963312B2Feb 24, 2015
Stacked chip package and method for forming the same
XINTEC INC11 citations84
US8803326B2Aug 12, 2014
Chip package
XINTEC INC7 citations84
US8772932B2Jul 8, 2014
Electronic device package
XINTEC INC4 citations84
US8552547B2Oct 8, 2013
Electronic device package and method for forming the same
XINTEC INC7 citations84
US8952501B2Feb 10, 2015
Chip package and method for forming the same
XINTEC INC14 citations83
US12341109B2Jun 24, 2025
Chip package and manufacturing method thereof
XINTEC INC1 citations75
US11784134B2Oct 10, 2023
Chip package and manufacturing method thereof
XINTEC INC1 citations73
US11521938B2Dec 6, 2022
Chip package including substrate inclined sidewall and redistribution line
XINTEC INC3 citations73
US10157875B2Dec 18, 2018
Chip package and method for forming the same
XINTEC INC4 citations73
US10152180B2Dec 11, 2018
Chip scale sensing chip package and a manufacturing method thereof
XINTEC INC2 citations73
US10056419B2Aug 21, 2018
Chip package having chip connected to sensing device with redistribution layer in insulator layer
XINTEC INC4 citations73
US9935148B2Apr 3, 2018
Method for forming chip package having chip connected to sensing device with redistribution layer in insulator layer
XINTEC INC4 citations73
US9887229B2Feb 6, 2018
Sensing chip package and a manufacturing method thereof
XINTEC INC2 citations73
US9881889B2Jan 30, 2018
Chip package and method for fabricating the same
XINTEC INC4 citations73
US9711425B2Jul 18, 2017
Sensing module and method for forming the same
XINTEC INC2 citations73
US9704772B2Jul 11, 2017
Chip package and method for forming the same
XINTEC INC2 citations73
US9633935B2Apr 25, 2017
Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the same
XINTEC INC5 citations73
US9611143B2Apr 4, 2017
Method for forming chip package
XINTEC INC2 citations73
US9570633B2Feb 14, 2017
Semiconductor package and manufacturing method thereof
XINTEC INC2 citations73
US9362134B2Jun 7, 2016
Chip package and fabrication method thereof
XINTEC INC5 citations73
US9355975B2May 31, 2016
Chip package and method for forming the same
XINTEC INC6 citations73
US9287417B2Mar 15, 2016
Semiconductor chip package and method for manufacturing thereof
XINTEC INC3 citations73
US9177905B2Nov 3, 2015
Chip package having sensing element and method for forming the same
XINTEC INC4 citations73
US8872196B2Oct 28, 2014
Chip package
XINTEC INC5 citations73
US10424540B2Sep 24, 2019
Chip package and method for forming the same
XINTEC INC2 citations72
US9640405B2May 2, 2017
Chip package having a laser stop structure
XINTEC INC2 citations72
US9543233B2Jan 10, 2017
Chip package having a dual through hole redistribution layer structure
XINTEC INC3 citations72
US8716109B2May 6, 2014
Chip package and fabrication method thereof
XINTEC INC4 citations72
US11450697B2Sep 20, 2022
Chip package with substrate having first opening surrounded by second opening and method for forming the same
XINTEC INC2 citations71
US11309271B2Apr 19, 2022
Chip structure and manufacturing method thereof
XINTEC INC4 citations71
US10050006B2Aug 14, 2018
Chip package and method for forming the same
XINTEC INC3 citations71
US9997473B2Jun 12, 2018
Chip package and method for forming the same
XINTEC INC2 citations71
US9947716B2Apr 17, 2018
Chip package and manufacturing method thereof
XINTEC INC2 citations71
US9653422B2May 16, 2017
Chip package and method for forming the same
XINTEC INC2 citations71
US10446504B2Oct 15, 2019
Chip package and method for forming the same
XINTEC INC5 citations70
US9972584B2May 15, 2018
Chip package and manufacturing method thereof
XINTEC INC2 citations70
US9601460B2Mar 21, 2017
Chip package including recess in side edge
XINTEC INC2 citations70
US8748926B2Jun 10, 2014
Chip package with multiple spacers and method for forming the same
XINTEC INC4 citations70
US9799778B2Oct 24, 2017
Chip package having a trench exposed protruding conductive pad
XINTEC INC3 citations67
US8975739B2Mar 10, 2015
Package structure and method for manufacturing thereof
XINTEC INC4 citations67
US11505457B2Nov 22, 2022
Semiconductor removing apparatus and operation method thereof
XINTEC INC2 citations65
US12477848B2Nov 18, 2025
Chip package and method for forming the same
XINTEC INC0 citations63
US11749618B2Sep 5, 2023
Chip package including substrate having through hole and redistribution line
XINTEC INC0 citations63
US10950738B2Mar 16, 2021
Chip package and method for forming the same
XINTEC INC0 citations63
US9379072B2Jun 28, 2016
Chip package and method for forming the same
XINTEC INC2 citations63
US9349710B2May 24, 2016
Chip package and method for forming the same
XINTEC INC2 citations63
US9334158B2May 10, 2016
Chip package and method for forming the same
XINTEC INC2 citations63
US9177919B2Nov 3, 2015
Chip package and method for forming the same
XINTEC INC3 citations63
Showing the top 50 of 188 patents by PatentIndex Score.