Assignee
XU JIANWEN
US·4 granted patents·43 citations·filing 2008–2011
Top patents by PatentIndex Score
4 records- 0191US8617935B2Back side alignment structure and manufacturing method for three-dimensional semiconductor device packagesXU JIANWEN·Filed 2011·Granted Dec 31, 2013·14 cites·20 claims
- 0290US8609471B2Packaging an integrated circuit die using compression moldingXU JIANWEN·Filed 2008·Granted Dec 17, 2013·21 cites·17 claims
- 0382US8327532B2Method for releasing a microelectronic assembly from a carrier substrateXU JIANWEN·Filed 2009·Granted Dec 11, 2012·8 cites·18 claims
- 0442US9054111B2Electronic device and method of packaging an electronic deviceXU JIANWEN·Filed 2009·Granted Jun 9, 2015·0 cites·25 claims
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