Assignee
XUE XIAOJIE
US·4 granted patents·33 citations·filing 2009–2012
Top patents by PatentIndex Score
4 records- 0190US8836132B2Vertical mount package and wafer level packaging thereforXUE XIAOJIE·Filed 2012·Granted Sep 16, 2014·12 cites·37 claims
- 0289US8692366B2Apparatus and method for microelectromechanical systems device packagingXUE XIAOJIE·Filed 2011·Granted Apr 8, 2014·9 cites·34 claims
- 0387US8624380B2Vertical mount package for MEMS sensorsXUE XIAOJIE·Filed 2012·Granted Jan 7, 2014·6 cites·11 claims
- 0475US8174111B2Vertical mount package for MEMS sensorsXUE XIAOJIE·Filed 2009·Granted May 8, 2012·6 cites·11 claims
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