Assignee
YABE ATSUSHI
JP·5 granted patents·2 pending applications·7 citations·filing 2004–2011
Top patents by PatentIndex Score
7 records- 0174US8537708B2Packet transmission method and nodesYABE ATSUSHI·Filed 2011·Granted Sep 17, 2013·7 cites·11 claims
- 0245US8394508B2Plated article having metal thin film formed by electroless platingYABE ATSUSHI·Filed 2008·Granted Mar 12, 2013·0 cites·10 claims
- 0345US8163400B2Plated article having metal thin film formed by electroless plating, and manufacturing method thereofYABE ATSUSHI·Filed 2008·Granted Apr 24, 2012·0 cites·22 claims
- 0444US2008224313A1Method for forming a seed layer for damascene copper wiring, and semiconductor wafer with damascene copper wiring formed using the methodYABE ATSUSHI·Filed 2008·Application pending·0 cites
- 0542US8521098B2Receiving apparatus, transmitting apparatus, receiving method, transmitting method, communications system, and communication methodYABE ATSUSHI·Filed 2011·Granted Aug 27, 2013·0 cites·15 claims
- 0641US8404035B2Electroless copper plating solutionYABE ATSUSHI·Filed 2004·Granted Mar 26, 2013·0 cites·1 claims
- 0734US2007071904A1Electroless copper plating solution and electroless copper plating methodYABE ATSUSHI·Filed 2004·Application pending·0 cites
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