Assignee
YAMADA YASUSHI
JP·4 granted patents·12 citations·filing 2008–2011
Top patents by PatentIndex Score
4 records- 0175US8471386B2Junction body, semiconductor module, and manufacturing method for junction bodyYAMADA YASUSHI·Filed 2010·Granted Jun 25, 2013·4 cites·32 claims
- 0272US8283783B2Solder material, method for manufacturing the same, joined body, method for manufacturing the same, power semiconductor module, and method for manufacturing the sameYAMADA YASUSHI·Filed 2008·Granted Oct 9, 2012·7 cites·27 claims
- 0357US8294272B2Power moduleYAMADA YASUSHI·Filed 2010·Granted Oct 23, 2012·1 cites·7 claims
- 0449US9079933B2Manufacturing method for polyphenol compositionYAMADA YASUSHI·Filed 2011·Granted Jul 14, 2015·0 cites·5 claims
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