Assignee
YAMAKAMI TAKATOYO
JP·2 granted patents·17 citations·filing 2011–2012
Top patents by PatentIndex Score
2 records- 0185US8720519B2Electronic packaging apparatus and electronic packaging methodYAMAKAMI TAKATOYO·Filed 2011·Granted May 13, 2014·9 cites·7 claims
- 0283US8418910B2Electroconductive bonding material, method for bonding conductor, and method for manufacturing semiconductor deviceYAMAKAMI TAKATOYO·Filed 2012·Granted Apr 16, 2013·8 cites·10 claims
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