Assignee
YAMASAKI TOMOO
JP·3 granted patents·5 citations·filing 2008–2011
Top patents by PatentIndex Score
3 records- 0175US8288659B2Wiring board and manufacturing method thereofYAMASAKI TOMOO·Filed 2010·Granted Oct 16, 2012·3 cites·5 claims
- 0258US8729401B2Wiring substrate and method of manufacturing the sameYAMASAKI TOMOO·Filed 2011·Granted May 20, 2014·1 cites·4 claims
- 0356US8066862B2Manufacturing method of wiring boardYAMASAKI TOMOO·Filed 2008·Granted Nov 29, 2011·1 cites·3 claims
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