Assignee
YANG HSUEH-AN
TW·3 granted patents·17 citations·filing 2008–2010
Top patents by PatentIndex Score
3 records- 0186US8836116B2Wafer level packaging of micro-electro-mechanical systems (MEMS) and complementary metal-oxide-semiconductor (CMOS) substratesYANG HSUEH-AN·Filed 2010·Granted Sep 16, 2014·8 cites·20 claims
- 0279US8277667B2Magnetic element and manufacturing method thereforYANG HSUEH-AN·Filed 2008·Granted Oct 2, 2012·9 cites·5 claims
- 0352US8263493B2Silicon chip having through via and method for making the sameYANG HSUEH-AN·Filed 2009·Granted Sep 11, 2012·0 cites·16 claims
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