Assignee

YANG JOUNGIN

KR·1 granted patent·4 citations·filing 2009–2009

Technology mixH10W1

Top patents by PatentIndex Score

1 record

0160US8476775B2Integrated circuit packaging system with embedded interconnect and method of manufacture thereofYANG JOUNGIN·Filed 2009·Granted Jul 2, 2013·4 cites·20 claims

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