Assignee
YANG KU-FENG
TW·8 granted patents·78 citations·filing 2007–2012
Top patents by PatentIndex Score
8 records- 0194US8119500B2Wafer bondingYANG KU-FENG·Filed 2007·Granted Feb 21, 2012·29 cites·18 claims
- 0291US8691664B2Backside process for a substrateYANG KU-FENG·Filed 2010·Granted Apr 8, 2014·14 cites·20 claims
- 0390US8580682B2Cost-effective TSV formationYANG KU-FENG·Filed 2010·Granted Nov 12, 2013·11 cites·18 claims
- 0486US8803322B2Through substrate via structures and methods of forming the sameYANG KU-FENG·Filed 2011·Granted Aug 12, 2014·7 cites·20 claims
- 0582US8500182B2Vacuum wafer carriers for strengthening thin wafersYANG KU-FENG·Filed 2010·Granted Aug 6, 2013·5 cites·15 claims
- 0681US8252682B2Method for thinning a waferYANG KU-FENG·Filed 2010·Granted Aug 28, 2012·8 cites·27 claims
- 0779US8232140B2Method for ultra thin wafer handling and processingYANG KU-FENG·Filed 2010·Granted Jul 31, 2012·4 cites·15 claims
- 0852US8629565B2Thin wafer protection deviceYANG KU-FENG·Filed 2012·Granted Jan 14, 2014·0 cites·20 claims
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