Assignee
YANG PING JUNG
TW·10 granted patents·2 pending applications·42 citations·filing 2011–2024
Top patents by PatentIndex Score
12 records- 0194US12062618B2Chip packageYANG PING JUNG·Filed 2023·Granted Aug 13, 2024·2 cites·20 claims
- 0294US11894306B2Chip packageYANG PING JUNG·Filed 2022·Granted Feb 6, 2024·2 cites·27 claims
- 0393US11538763B2Chip packageYANG PING JUNG·Filed 2021·Granted Dec 27, 2022·4 cites·23 claims
- 0491US10622310B2Method for fabricating glass substrate packageYANG PING JUNG·Filed 2016·Granted Apr 14, 2020·5 cites·20 claims
- 0590US9615453B2Method for fabricating glass substrate packageYANG PING-JUNG·Filed 2013·Granted Apr 4, 2017·12 cites·20 claims
- 0687US2025132260A1Chip packageYANG PING JUNG·Filed 2024·Application pending·0 cites
- 0785US2024379566A1Chip packageYANG PING JUNG·Filed 2024·Application pending·0 cites
- 0883US8837872B2Waveguide structures for signal and/or power transmission in a semiconductor deviceYANG PING-JUNG·Filed 2011·Granted Sep 16, 2014·8 cites·20 claims
- 0982US8431977B2Wafer level processing method and structure to manufacture semiconductor chipYANG PING-JUNG·Filed 2011·Granted Apr 30, 2013·8 cites·20 claims
- 1069US11107768B2Chip packageYANG PING JUNG·Filed 2020·Granted Aug 31, 2021·0 cites·28 claims
- 1167US10096565B2Method for fabricating glass substrate packageYANG PING JUNG·Filed 2017·Granted Oct 9, 2018·1 cites·20 claims
- 1255US10453819B2Method for fabricating glass substrate packageYANG PING JUNG·Filed 2018·Granted Oct 22, 2019·0 cites·20 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →