Assignee
YAP WENG F
US11 patents
Top patents by PatentIndex Score
US9299670B2Mar 29, 2016
Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof
YAP WENG F39 citations94
US9281284B2Mar 8, 2016
System-in-packages having vertically-interconnected leaded components and methods for the fabrication thereof
YAP WENG F11 citations84
US9281286B1Mar 8, 2016
Microelectronic packages having texturized solder pads and methods for the fabrication thereof
YAP WENG F7 citations83
US9129981B2Sep 8, 2015
Methods for the production of microelectronic packages having radiofrequency stand-off layers
YAP WENG F11 citations82
US9997492B2Jun 12, 2018
Optically-masked microelectronic packages and methods for the fabrication thereof
YAP WENG F2 citations73
US9257419B2Feb 9, 2016
Leadframe-based system-in-packages having sidewall-mounted surface mount devices and methods for the production thereof
YAP WENG F5 citations73
US9024429B2May 5, 2015
Microelectronic packages containing opposing devices and methods for the fabrication thereof
YAP WENG F6 citations73
US9401339B2Jul 26, 2016
Wafer level packages having non-wettable solder collars and methods for the fabrication thereof
YAP WENG F3 citations72
US8963318B2Feb 24, 2015
Packaged semiconductor device
YAP WENG F2 citations62
US9524950B2Dec 20, 2016
Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof
YAP WENG F1 citations52
US8741666B1Jun 3, 2014
Methods relating to intermetallic testing of bond integrity between bond pads and copper-containing bond wires
YAP WENG F0 citations36