Assignee

YASUDA YUUSUKE

JP·1 granted patent·8 citations·filing 2010–2010

Technology mixB22F1 C22C1 H01B1 H01L1 H10W1

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1 record

0177US8840811B2Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the sameYASUDA YUUSUKE·Filed 2010·Granted Sep 23, 2014·8 cites·16 claims

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