Assignee
YEE JAE HAK
CN·6 granted patents·5 citations·filing 2007–2012
Top patents by PatentIndex Score
6 records- 0178US8501540B2Method for manufacture of inline integrated circuit systemYEE JAE HAK·Filed 2011·Granted Aug 6, 2013·4 cites·5 claims
- 0258US8847413B2Integrated circuit package system with leads having multiple sides exposedYEE JAE HAK·Filed 2008·Granted Sep 30, 2014·1 cites·20 claims
- 0351US8138591B2Integrated circuit package system with stacked dieYEE JAE HAK·Filed 2007·Granted Mar 20, 2012·0 cites·10 claims
- 0449US8810019B2Integrated circuit package system with stacked dieYEE JAE HAK·Filed 2012·Granted Aug 19, 2014·0 cites·10 claims
- 0548US8937372B2Integrated circuit package system with molded strip protrusionYEE JAE HAK·Filed 2007·Granted Jan 20, 2015·0 cites·20 claims
- 0645US9202776B2Stackable multi-chip package systemYEE JAE HAK·Filed 2007·Granted Dec 1, 2015·0 cites·20 claims
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