Assignee
YEH TUNG-TI
TW·2 granted patents·1 pending application·2 citations·filing 2009–2012
Top patents by PatentIndex Score
3 records- 0164US8748885B2Soft material wafer bonding and method of bondingYEH TUNG-TI·Filed 2012·Granted Jun 10, 2014·2 cites·20 claims
- 0245US2010213431A1Treated Chalcogenide Layer for Semiconductor DevicesYEH TUNG-TI·Filed 2009·Application pending·0 cites
- 0335US8592297B2Wafer and method of processing waferYEH TUNG-TI·Filed 2011·Granted Nov 26, 2013·0 cites·20 claims
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