Assignee
YIM MYUNG JIN
US·3 granted patents·1 pending application·10 citations·filing 2008–2011
Top patents by PatentIndex Score
4 records- 0177US8409927B1Methods for fabricating integrated circuit systems including high reliability die under-fillYIM MYUNG JIN·Filed 2011·Granted Apr 2, 2013·5 cites·20 claims
- 0268US9041228B2Molding compound including a carbon nano-tube dispersionYIM MYUNG JIN·Filed 2008·Granted May 26, 2015·3 cites·19 claims
- 0356US8451620B2Package including an underfill material in a portion of an area between the package and a substrate or another packageYIM MYUNG JIN·Filed 2009·Granted May 28, 2013·2 cites·32 claims
- 0444US2010123258A1Low Temperature Board Level Assembly Using Anisotropically Conductive MaterialsYIM MYUNG JIN·Filed 2008·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when YIM MYUNG JIN files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →