Assignee
YOKOYAMA KENJI
JP·4 granted patents·4 pending applications·17 citations·filing 2007–2012
Top patents by PatentIndex Score
8 records- 0183US8456025B2Semiconductor chip having staggered arrangement of bonding padsYOKOYAMA KENJI·Filed 2011·Granted Jun 4, 2013·7 cites·16 claims
- 0277US8759941B2Semiconductor integrated circuit device and method for designing the sameYOKOYAMA KENJI·Filed 2012·Granted Jun 24, 2014·4 cites·6 claims
- 0374US8512308B2Connector, syringe assembly, and connector for mixingYOKOYAMA KENJI·Filed 2011·Granted Aug 20, 2013·4 cites·14 claims
- 0474US8409712B2Alloy to be surface-coated and sliding membersYOKOYAMA KENJI·Filed 2009·Granted Apr 2, 2013·2 cites·5 claims
- 0544US2012172830A1Mixing apparatus and piercing method for a double-ended needleYOKOYAMA KENJI·Filed 2010·Application pending·0 cites
- 0643US2007232594A1Aromatic amide derivatives, medicinal compositions containing the same, medical uses of bothYOKOYAMA KENJI·Filed 2007·Application pending·0 cites
- 0742US2012306879A1Information processing apparatus, information processing method, and programYOKOYAMA KENJI·Filed 2012·Application pending·0 cites
- 0839US2012199969A1Semiconductor deviceYOKOYAMA KENJI·Filed 2012·Application pending·0 cites
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