Assignee
YOSHIKAWA EIJI
JP·4 granted patents·3 citations·filing 2010–2014
Top patents by PatentIndex Score
4 records- 0172US8647908B2Semiconductor pressure sensor and method of manufacturing semiconductor pressure sensorYOSHIKAWA EIJI·Filed 2012·Granted Feb 11, 2014·2 cites·8 claims
- 0259US9212049B2SOI wafer, manufacturing method therefor, and MEMS deviceYOSHIKAWA EIJI·Filed 2013·Granted Dec 15, 2015·1 cites·12 claims
- 0351US9266715B2SOI wafer, manufacturing method therefor, and MEMS deviceYOSHIKAWA EIJI·Filed 2014·Granted Feb 23, 2016·0 cites·8 claims
- 0439US8710600B2Semiconductor pressure sensorYOSHIKAWA EIJI·Filed 2010·Granted Apr 29, 2014·0 cites·8 claims
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