Assignee

YU CHUN HUI

TW·2 granted patents·111 citations·filing 2011–2012

Technology mixH01L2 H10W2 H10P1

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2 records

0197US8754514B2Multi-chip wafer level packageYU CHUN HUI·Filed 2011·Granted Jun 17, 2014·107 cites·20 claims
0273US9583365B2Method of forming interconnects for three dimensional integrated circuitYU CHUN HUI·Filed 2012·Granted Feb 28, 2017·4 cites·18 claims

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