Assignee
YUN CHANGHAN
US·1 granted patent·2 pending applications·0 citations·filing 2011–2012
Top patents by PatentIndex Score
3 records- 0151US8907450B2Metal-semiconductor wafer bonding for high-Q devicesYUN CHANGHAN·Filed 2011·Granted Dec 9, 2014·0 cites·7 claims
- 0238US2013207745A13d rf l-c filters using through glass viasYUN CHANGHAN·Filed 2012·Application pending·0 cites
- 0329US2012293520A1Piezoelectric resonators with configurations having no ground connections to enhance electromechanical couplingYUN CHANGHAN·Filed 2011·Application pending·0 cites
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