Assignee
YUN JAEUN
KR·2 granted patents·1 pending application·4 citations·filing 2009–2011
Top patents by PatentIndex Score
3 records- 0173US8524537B2Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residueYUN JAEUN·Filed 2010·Granted Sep 3, 2013·4 cites·28 claims
- 0245US8415204B2Integrated circuit packaging system with heat spreader and method of manufacture thereofYUN JAEUN·Filed 2009·Granted Apr 9, 2013·0 cites·20 claims
- 0339US2012224332A1Integrated circuit packaging system with bump bonded dies and method of manufacture thereofYUN JAEUN·Filed 2011·Application pending·0 cites
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