Assignee
YUNG CHUNG SHEUNG
CN·2 granted patents·13 citations·filing 2012–2012
Top patents by PatentIndex Score
2 records- 0182US8387851B1Apparatus for aligning a bonding tool of a die bonderYUNG CHUNG SHEUNG·Filed 2012·Granted Mar 5, 2013·9 cites·15 claims
- 0272US8875979B2Apparatus and method for determining an alignment of a bondhead of a die bonder relative to a workchuckYUNG CHUNG SHEUNG·Filed 2012·Granted Nov 4, 2014·4 cites·10 claims
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