Assignee
ZENG ZHAO-CHONG
TW·3 granted patents·2 pending applications·2 citations·filing 2009–2012
Top patents by PatentIndex Score
5 records- 0160US8242383B2Packaging substrate with embedded semiconductor component and method for fabricating the sameZENG ZHAO CHONG·Filed 2009·Granted Aug 14, 2012·2 cites·5 claims
- 0246US9295159B2Method for fabricating packaging substrate with embedded semiconductor componentZENG ZHAO CHONG·Filed 2012·Granted Mar 22, 2016·0 cites·14 claims
- 0345US8884429B2Package structure having embedded electronic component and fabrication method thereofZENG ZHAO-CHONG·Filed 2012·Granted Nov 11, 2014·0 cites·10 claims
- 0437US2013258623A1Package structure having embedded electronic element and fabrication method thereofZENG ZHAO-CHONG·Filed 2012·Application pending·0 cites
- 0535US2012049366A1Package structure having through-silicon-via (tsv) chip embedded therein and fabrication method thereofZENG ZHAO-CHONG·Filed 2011·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →