Assignee
ZHANG QINGLEI
US·1 granted patent·1 pending application·2 citations·filing 2011–2013
Top patents by PatentIndex Score
2 records- 0160US9299602B2Enabling package-on-package (PoP) pad surface finishes on bumpless build-up layer (BBUL) packageZHANG QINGLEI·Filed 2011·Granted Mar 29, 2016·2 cites·25 claims
- 0242US2014376195A1Methods of forming dual sided coreless package structures with land side capacitorZHANG QINGLEI·Filed 2013·Application pending·0 cites
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