Assignee
ZHANG XIAOTIAN
CN·7 granted patents·3 pending applications·38 citations·filing 2005–2013
Top patents by PatentIndex Score
10 records- 0186US7511361B2DFN semiconductor package having reduced electrical resistanceZHANG XIAOTIAN·Filed 2005·Granted Mar 31, 2009·13 cites·8 claims
- 0282US8150982B2Method, system for accessing home network device and home network access deviceZHANG XIAOTIAN·Filed 2009·Granted Apr 3, 2012·11 cites·2 claims
- 0381US9006870B2Stacked multi-chip packaging structure and manufacturing method thereofZHANG XIAOTIAN·Filed 2013·Granted Apr 14, 2015·4 cites·12 claims
- 0477US8669650B2Flip chip semiconductor deviceZHANG XIAOTIAN·Filed 2011·Granted Mar 11, 2014·5 cites·27 claims
- 0574US8455303B2Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing methodZHANG XIAOTIAN·Filed 2012·Granted Jun 4, 2013·3 cites·8 claims
- 0662US8484318B2Method, apparatus and system for upgrading through multicastZHANG XIAOTIAN·Filed 2011·Granted Jul 9, 2013·2 cites·20 claims
- 0747US2011068457A1Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing methodZHANG XIAOTIAN·Filed 2009·Application pending·0 cites
- 0846US8222088B2Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing methodZHANG XIAOTIAN·Filed 2010·Granted Jul 17, 2012·0 cites·8 claims
- 0945US2012166660A1Method, system for accessing home network device, and home network access deviceZHANG XIAOTIAN·Filed 2012·Application pending·0 cites
- 1038US2011098832A1Control apparatus and control systemZHANG XIAOTIAN·Filed 2010·Application pending·0 cites
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