Assignee
ZHANG XUEREN
SG·3 granted patents·1 pending application·17 citations·filing 2007–2011
Top patents by PatentIndex Score
4 records- 0181US8772943B2Offset of contact opening for copper pillars in flip chip packagesZHANG XUEREN·Filed 2011·Granted Jul 8, 2014·7 cites·14 claims
- 0267US8800391B2Piezo-resistive force sensor with bumps on membrane structureZHANG XUEREN·Filed 2007·Granted Aug 12, 2014·8 cites·24 claims
- 0364US8796826B2Window clamp top plate for integrated circuit packagingZHANG XUEREN·Filed 2011·Granted Aug 5, 2014·2 cites·29 claims
- 0436US2013093072A1Leadframe pad design with enhanced robustness to die crack failureZHANG XUEREN·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →