Assignee

ZHOU JIJIE

CN·1 granted patent·5 citations·filing 2007–2007

Technology mixB82Y1 H10W1

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1 record

0164US8647922B2Method of forming an interconnect on a semiconductor substrateZHOU JIJIE·Filed 2007·Granted Feb 11, 2014·5 cites·23 claims

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