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ZIPTRONIX INC
US42 patents
Top patents by PatentIndex Score
US9431368B2Aug 30, 2016
Three dimensional device integration method and integrated device
ZIPTRONIX INC194 citations99
US9391143B2Jul 12, 2016
Method for low temperature bonding and bonded structure
ZIPTRONIX INC117 citations99
US9331149B2May 3, 2016
Method for low temperature bonding and bonded structure
ZIPTRONIX INC185 citations99
US9171756B2Oct 27, 2015
3D IC method and device
ZIPTRONIX INC232 citations99
US7485968B2Feb 3, 2009
3D IC method and device
ZIPTRONIX INC433 citations99
US7387944B2Jun 17, 2008
Method for low temperature bonding and bonded structure
ZIPTRONIX INC68 citations99
US7109092B2Sep 19, 2006
Method of room temperature covalent bonding
ZIPTRONIX INC331 citations99
US7041178B2May 9, 2006
Method for low temperature bonding and bonded structure
ZIPTRONIX INC129 citations99
US6984571B1Jan 10, 2006
Three dimensional device integration method and integrated device
ZIPTRONIX INC162 citations99
US6902987B1Jun 7, 2005
Method for low temperature bonding and bonded structure
ZIPTRONIX INC227 citations99
US6867073B1Mar 15, 2005
Single mask via method and device
ZIPTRONIX INC216 citations99
US6864585B2Mar 8, 2005
Three dimensional device integration method and integrated device
ZIPTRONIX INC114 citations99
US6563133B1May 13, 2003
Method of epitaxial-like wafer bonding at low temperature and bonded structure
ZIPTRONIX INC185 citations99
US6500694B1Dec 31, 2002
Three dimensional device integration method and integrated device
ZIPTRONIX INC156 citations99
US9716033B2Jul 25, 2017
3D IC method and device
ZIPTRONIX INC29 citations98
US9564414B2Feb 7, 2017
Three dimensional device integration method and integrated device
ZIPTRONIX INC37 citations98
US9385024B2Jul 5, 2016
Room temperature metal direct bonding
ZIPTRONIX INC211 citations98
US9184125B2Nov 10, 2015
Heterogeneous annealing method and device
ZIPTRONIX INC205 citations98
US6962835B2Nov 8, 2005
Method for room temperature metal direct bonding
ZIPTRONIX INC235 citations98
US9082627B2Jul 14, 2015
Method for low temperature bonding and bonded structure
ZIPTRONIX INC20 citations96
US7807549B2Oct 5, 2010
Method for low temperature bonding and bonded structure
ZIPTRONIX INC41 citations96
US7602070B2Oct 13, 2009
Room temperature metal direct bonding
ZIPTRONIX INC33 citations96
US7553744B2Jun 30, 2009
Method for low temperature bonding and bonded structure
ZIPTRONIX INC35 citations96
US7335572B2Feb 26, 2008
Method for low temperature bonding and bonded structure
ZIPTRONIX INC39 citations96
US7037755B2May 2, 2006
Three dimensional device integration method and integrated device
ZIPTRONIX INC58 citations96
US6905557B2Jun 14, 2005
Three dimensional integrated device
ZIPTRONIX INC33 citations96
US6627531B2Sep 30, 2003
Three dimensional device integration method and integrated device
ZIPTRONIX INC73 citations96
US7126212B2Oct 24, 2006
Three dimensional device integration method and integrated device
ZIPTRONIX INC247 citations95
US8709938B2Apr 29, 2014
3D IC method and device
ZIPTRONIX INC13 citations93
US8053329B2Nov 8, 2011
Method for low temperature bonding and bonded structure
ZIPTRONIX INC7 citations93
US7871898B2Jan 18, 2011
Method for low temperature bonding and bonded structure
ZIPTRONIX INC9 citations93
US7862885B2Jan 4, 2011
Method of room temperature covalent bonding
ZIPTRONIX INC11 citations93
US7462552B2Dec 9, 2008
Method of detachable direct bonding at low temperatures
ZIPTRONIX INC42 citations93
US7341938B2Mar 11, 2008
Single mask via method and device
ZIPTRONIX INC14 citations93
US7335996B2Feb 26, 2008
Method of room temperature covalent bonding
ZIPTRONIX INC15 citations93
US7332410B2Feb 19, 2008
Method of epitaxial-like wafer bonding at low temperature and bonded structure
ZIPTRONIX INC23 citations93
US7842540B2Nov 30, 2010
Room temperature metal direct bonding
ZIPTRONIX INC11 citations92
US6740909B2May 25, 2004
Self aligned symmetric intrinsic process and device
ZIPTRONIX INC29 citations92
US9698126B2Jul 4, 2017
Heterogeneous annealing method and device
ZIPTRONIX INC7 citations83
US8846450B2Sep 30, 2014
Room temperature metal direct bonding
ZIPTRONIX INC5 citations79
US7956447B2Jun 7, 2011
Wafer scale die handling
ZIPTRONIX INC7 citations74
US7714446B2May 11, 2010
Single mask via method and device
ZIPTRONIX INC7 citations74