Assignee

ZOU QUANBO

NL·2 granted patents·5 citations·filing 2011–2012

Technology mixH01L2 H10W2 B81C1 C25D1 H10H1

Top patents by PatentIndex Score

2 records

0174US9343612B2Method of bonding a semiconductor device to a support substrateZOU QUANBO·Filed 2012·Granted May 17, 2016·5 cites·12 claims
0258US8970043B2Bonded stacked wafers and methods of electroplating bonded stacked wafersZOU QUANBO·Filed 2011·Granted Mar 3, 2015·0 cites·16 claims

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