Assignee
ZU LONGQIANG
US·2 granted patents·12 citations·filing 2008–2011
Top patents by PatentIndex Score
2 records- 0179US8152048B2Method and structure for adapting solder column to warped substrateZU LONGQIANG·Filed 2008·Granted Apr 10, 2012·10 cites·9 claims
- 0263US8247909B2Semiconductor package device with cavity structure and the packaging method thereofZU LONGQIANG·Filed 2011·Granted Aug 21, 2012·2 cites·18 claims
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