Assignee
ZUNIGA-ORTIZ EDGAR R
0 granted patents·3 pending applications·0 citations·filing 2004–2005
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0145US2006006532A1Flip-chip without bumps and polymer for board assemblyZUNIGA-ORTIZ EDGAR R·Filed 2005·Application pending·0 cites
- 0242US2006125062A1Semiconductor package having improved adhesion and solderabilityZUNIGA-ORTIZ EDGAR R·Filed 2004·Application pending·0 cites
- 0337US2006170080A1Semiconductor device having directly attached heat spreaderZUNIGA-ORTIZ EDGAR R·Filed 2005·Application pending·0 cites
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