Assignee
ZYCON CORP
US11 patents
Top patents by PatentIndex Score
US5261153ANov 16, 1993
In situ method for forming a capacitive PCB
ZYCON CORP239 citations98
US5161086ANov 3, 1992
Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
ZYCON CORP225 citations98
US5155655AOct 13, 1992
Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
ZYCON CORP247 citations98
US5079069AJan 7, 1992
Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
ZYCON CORP338 citations98
US5800575ASep 1, 1998
In situ method of forming a bypass capacitor element internally within a capacitive PCB
ZYCON CORP113 citations97
US5708569AJan 13, 1998
Annular circuit components coupled with printed circuit board through-hole
ZYCON CORP221 citations97
US5466892ANov 14, 1995
Circuit boards including capacitive coupling for signal transmission and methods of use and manufacture
ZYCON CORP115 citations97
US5347258ASep 13, 1994
Annular resistor coupled with printed circuit board through-hole
ZYCON CORP131 citations96
US5603847AFeb 18, 1997
Annular circuit components coupled with printed circuit board through-hole
ZYCON CORP79 citations94
US5144742ASep 8, 1992
Method of making rigid-flex printed circuit boards
ZYCON CORP78 citations94
US5064583ANov 12, 1991
Method for applying mold release coating to separator plates for molding printed circuit boards
ZYCON CORP30 citations86