Assignee
1ST SILICON MALAYSIA SDN BHD
MY·4 granted patents·1 pending application·11 citations·filing 2002–2003
Top patents by PatentIndex Score
5 records- 0141US6952886B1Overlay vernier1ST SILICON MALAYSIA SDN BHD·Filed 2003·Granted Oct 11, 2005·9 cites·5 claims
- 0236US7030004B2Method for forming bond pad openings1ST SILICON MALAYSIA SDN BHD·Filed 2003·Granted Apr 18, 2006·0 cites·6 claims
- 0328US6903028B2Soft-landing etching method using doping level control1ST SILICON MALAYSIA SDN BHD·Filed 2002·Granted Jun 7, 2005·1 cites·11 claims
- 0427US7045467B2Method for determining endpoint of etch layer and etching process implementing said method in semiconductor element fabrication1ST SILICON MALAYSIA SDN BHD·Filed 2003·Granted May 16, 2006·1 cites·5 claims
- 0527US2003211723A1Semiconductor devices and method for their manufacture1ST SILICON MALAYSIA SDN BHD·Filed 2002·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →