Assignee

ADAVANCED CHIP ENGINEERING TEC

TW·1 granted patent·6 citations·filing 2007–2007

Technology mixH04N1 H10F1 H10W1

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0168US7498556B2Image sensor module having build-in package cavity and the method of the sameADAVANCED CHIP ENGINEERING TEC·Filed 2007·Granted Mar 3, 2009·6 cites·15 claims

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