Assignee

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC

US·137 granted patents·187 pending applications·502 citations·filing 2017–2025

Technology mixH10W301 H01L294 H10P92 H10B21 H10D21 B81C18

Top patents by PatentIndex Score

324 records

0199US12113056B2Stacked dies and methods for forming bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Oct 8, 2024·6 cites·53 claims
0299US12046482B2Microelectronic assembliesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Jul 23, 2024·7 cites·26 claims
0399US12046569B2Integrated device packages with integrated device die and dummy elementADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Jul 23, 2024·6 cites·34 claims
0499US11916054B2Stacked devices and methods of fabricationADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Feb 27, 2024·6 cites·18 claims
0599US11842894B2Electrical redundancy for bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Dec 12, 2023·14 cites·33 claims
0699US11837596B2Stacked dies and methods for forming bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Dec 5, 2023·10 cites·35 claims
0799US11817409B2Directly bonded structures without intervening adhesive and methods for forming the sameADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Nov 14, 2023·13 cites·30 claims
0899US11804377B2Method for preparing a surface for direct-bondingADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Oct 31, 2023·5 cites·20 claims
0999US11764177B2Bonded structure with interconnect structureADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Sep 19, 2023·22 cites·19 claims
1099US11762200B2Bonded optical devicesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Sep 19, 2023·11 cites·32 claims
1199US11742315B2Die processingADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Aug 29, 2023·5 cites·35 claims
1299US11735523B2Laterally unconfined structureADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Aug 22, 2023·13 cites·16 claims
1399US11728273B2Bonded structure with interconnect structureADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Aug 15, 2023·24 cites·23 claims
1499US11658173B2Stacked dies and methods for forming bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted May 23, 2023·19 cites·27 claims
1599US11631647B2Integrated device packages with integrated device die and dummy elementADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Apr 18, 2023·24 cites·31 claims
1699US11538781B2Integrated device packages including bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Dec 27, 2022·14 cites·30 claims
1798US12266640B2Molded direct bonded and interconnected stackADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Apr 1, 2025·4 cites·35 claims
1898US12266650B2Stacked dies and methods for forming bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Apr 1, 2025·3 cites·19 claims
1998US12218107B2Electrical redundancy for bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Feb 4, 2025·3 cites·20 claims
2098US12198981B2Diffusion barrier collar for interconnectsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Jan 14, 2025·3 cites·34 claims
2198US12199069B2Heterogeneous annealing method and deviceADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Jan 14, 2025·3 cites·21 claims
2298US12100684B2Bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Sep 24, 2024·3 cites·26 claims
2398US12046583B2Electrical redundancy for bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Jul 23, 2024·4 cites·21 claims
2498US11955463B2Direct bonded stack structures for increased reliability and improved yield in microelectronicsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Apr 9, 2024·6 cites·55 claims
2598US11955445B2Metal pads over TSVADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Apr 9, 2024·5 cites·23 claims
2698US11860415B2Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnectsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Jan 2, 2024·9 cites·17 claims
2798US11855064B2Techniques for processing devicesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Dec 26, 2023·5 cites·32 claims
2898US11848284B2Protective elements for bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Dec 19, 2023·7 cites·16 claims
2998US11837582B2Molded direct bonded and interconnected stackADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Dec 5, 2023·14 cites·33 claims
3098US11764189B2Molded direct bonded and interconnected stackADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Sep 19, 2023·17 cites·30 claims
3198US11756880B2Interconnect structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Sep 12, 2023·6 cites·28 claims
3298US11728287B2Wafer-level bonding of obstructive elementsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Aug 15, 2023·7 cites·36 claims
3398US11721653B2Circuitry for electrical redundancy in bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Aug 8, 2023·12 cites·21 claims
3498US11694925B2Diffusion barrier collar for interconnectsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Jul 4, 2023·3 cites·36 claims
3598US11670615B2Bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Jun 6, 2023·6 cites·23 claims
3698US11652083B2Processed stacked diesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted May 16, 2023·18 cites·29 claims
3798US11631586B2Heterogeneous annealing methodADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Apr 18, 2023·4 cites·22 claims
3898US11610846B2Protective elements for bonded structures including an obstructive elementADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Mar 21, 2023·9 cites·18 claims
3998US11600542B2Cavity packagesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Mar 7, 2023·6 cites·23 claims
4098US11552041B2Chemical mechanical polishing for hybrid bondingADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Jan 10, 2023·8 cites·29 claims
4198US11515279B2Low temperature bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Nov 29, 2022·10 cites·22 claims
4297US12308332B2Circuitry for electrical redundancy in bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Granted May 20, 2025·2 cites·22 claims
4397US12272677B2Direct bonded stack structures for increased reliability and improved yield in microelectronicsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Granted Apr 8, 2025·3 cites·21 claims
4497US12046571B2Low temperature bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Jul 23, 2024·3 cites·5 claims
4597US12009338B2Dimension compensation control for directly bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Jun 11, 2024·4 cites·20 claims
4697US11948847B2Bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Apr 2, 2024·3 cites·33 claims
4797US11728313B2Offset pads over TSVADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Aug 15, 2023·4 cites·22 claims
4897US11626363B2Bonded structures with integrated passive componentADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2017·Granted Apr 11, 2023·16 cites·25 claims
4996US12243851B2Offset pads over TSVADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Mar 4, 2025·2 cites·20 claims
5096US12176303B2Wafer-level bonding of obstructive elementsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Dec 24, 2024·2 cites·19 claims

Showing the top 50 of 324 patent records by PatentIndex Score.

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