Assignee
ADVANCE MATERIALS CORP
TW·3 granted patents·1 pending application·9 citations·filing 2001–2014
Top patents by PatentIndex Score
4 records- 0173US8987060B2Method for making circuit boardADVANCE MATERIALS CORP·Filed 2013·Granted Mar 24, 2015·3 cites·6 claims
- 0260US6555592B2Photothermosetting composition comprising acrylated epoxy resinADVANCE MATERIALS CORP·Filed 2001·Granted Apr 29, 2003·6 cites·12 claims
- 0345US9084341B2Fabrication method of packaging substrateADVANCE MATERIALS CORP·Filed 2014·Granted Jul 14, 2015·0 cites·9 claims
- 0442US2006093805A1Dielectric constant adjustable resin composition, prepreg and copper clad laminate utilizing the sameADVANCE MATERIALS CORP·Filed 2005·Application pending·0 cites
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