Assignee
ADVANCED INTERCONNECT TECH LTD
HK·14 granted patents·1,113 citations·filing 1990–2005
Top patents by PatentIndex Score
14 records- 0198US6812552B2Partially patterned lead frames and methods of making and using the same in semiconductor packagingADVANCED INTERCONNECT TECH LTD·Filed 2002·Granted Nov 2, 2004·264 cites·12 claims
- 0297US7262491B2Die pad for semiconductor packages and methods of making and using sameADVANCED INTERCONNECT TECH LTD·Filed 2005·Granted Aug 28, 2007·89 cites·18 claims
- 0394US6501185B1Barrier cap for under bump metalADVANCED INTERCONNECT TECH LTD·Filed 2002·Granted Dec 31, 2002·129 cites·18 claims
- 0494US6413851B1Method of fabrication of barrier cap for under bump metalADVANCED INTERCONNECT TECH LTD·Filed 2001·Granted Jul 2, 2002·124 cites·21 claims
- 0592US7259445B2Thermal enhanced package for block mold assemblyADVANCED INTERCONNECT TECH LTD·Filed 2003·Granted Aug 21, 2007·101 cites·13 claims
- 0692US7129116B2Partially patterned lead frames and methods of making and using the same in semiconductor packagingADVANCED INTERCONNECT TECH LTD·Filed 2004·Granted Oct 31, 2006·41 cites·11 claims
- 0789US6638847B1Method of forming lead-free bump interconnectionsADVANCED INTERCONNECT TECH LTD·Filed 2000·Granted Oct 28, 2003·119 cites·11 claims
- 0886US6262477B1Ball grid array electronic packageADVANCED INTERCONNECT TECH LTD·Filed 1993·Granted Jul 17, 2001·88 cites·28 claims
- 0985US6777265B2Partially patterned lead frames and methods of making and using the same in semiconductor packagingADVANCED INTERCONNECT TECH LTD·Filed 2003·Granted Aug 17, 2004·43 cites·13 claims
- 1081US6300673B1Edge connectable metal packageADVANCED INTERCONNECT TECH LTD·Filed 1995·Granted Oct 9, 2001·56 cites·17 claims
- 1172US7247933B2Thin multiple semiconductor die packageADVANCED INTERCONNECT TECH LTD·Filed 2004·Granted Jul 24, 2007·16 cites·18 claims
- 1265US7489021B2Lead frame with included passive devicesADVANCED INTERCONNECT TECH LTD·Filed 2004·Granted Feb 10, 2009·17 cites·35 claims
- 1354US5952719AMetal ball grid electronic package having improved solder jointADVANCED INTERCONNECT TECH LTD·Filed 1997·Granted Sep 14, 1999·20 cites·20 claims
- 1423US5071381AProcess for the manufacture of straw tube drift chambersADVANCED INTERCONNECT TECH LTD·Filed 1990·Granted Dec 10, 1991·6 cites·20 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →