Assignee

ADVANCED TECHNOLOGIES MATERIAL

US·1 granted patent·10 citations·filing 2001–2001

Technology mixC11D1 C23G1 G03F1 H10P1

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0163US6660700B2Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structuresADVANCED TECHNOLOGIES MATERIAL·Filed 2001·Granted Dec 9, 2003·10 cites·14 claims

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