Assignee
AIROHA TECH HK LIMITED
HK·3 granted patents·0 citations·filing 2022–2022
Top patents by PatentIndex Score
3 records- 0156US12327806B2Semiconductor die with peculiar bond pad arrangement for leveraging mutual inductance between bond wires to realize bond wire T-coil circuit with equivalent negative inductanceAIROHA TECH HK LIMITED·Filed 2022·Granted Jun 10, 2025·0 cites·17 claims
- 0255US12176895B2Apparatus and method for generating dummy signal that has transitions constrained to occur within transition enable windows set by detection of more than two consecutive identical digits in serial dataAIROHA TECH HK LIMITED·Filed 2022·Granted Dec 24, 2024·0 cites·14 claims
- 0354US12278206B2Semiconductor package with conductive adhesive that overflows for return path reduction and associated methodAIROHA TECH HK LIMITED·Filed 2022·Granted Apr 15, 2025·0 cites·8 claims
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