Assignee
AKIYAMA HAJIME
JP·6 granted patents·13 citations·filing 2008–2013
Top patents by PatentIndex Score
6 records- 0189US9347988B2Semiconductor testing jig and semiconductor testing method performed by using the sameAKIYAMA HAJIME·Filed 2013·Granted May 24, 2016·9 cites·11 claims
- 0263US8125045B2Dielectric isolation type semiconductor device and manufacturing method thereforAKIYAMA HAJIME·Filed 2008·Granted Feb 28, 2012·2 cites·4 claims
- 0362US8823360B2Semiconductor deviceAKIYAMA HAJIME·Filed 2011·Granted Sep 2, 2014·1 cites·4 claims
- 0462US8071454B1Method for manufacturing dielectric isolation type semiconductor deviceAKIYAMA HAJIME·Filed 2010·Granted Dec 6, 2011·1 cites·7 claims
- 0545US9312160B2Wafer suction method, wafer suction stage, and wafer suction systemAKIYAMA HAJIME·Filed 2012·Granted Apr 12, 2016·0 cites·9 claims
- 0644US8110449B2Semiconductor device and method of manufacturing the sameAKIYAMA HAJIME·Filed 2010·Granted Feb 7, 2012·0 cites·2 claims
Join the waitlist — get patent alerts
Get an alert when AKIYAMA HAJIME files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →