Assignee
AKUTSU YASUSHI
JP·7 granted patents·1 citations·filing 2008–2012
Top patents by PatentIndex Score
7 records- 0160US8221880B2Adhesive compositionAKUTSU YASUSHI·Filed 2008·Granted Jul 17, 2012·0 cites·6 claims
- 0258US8524032B2Connecting film, and joined structure and method for producing the sameAKUTSU YASUSHI·Filed 2012·Granted Sep 3, 2013·0 cites·2 claims
- 0357US9023464B2Connecting film, and joined structure and method for producing the sameAKUTSU YASUSHI·Filed 2010·Granted May 5, 2015·1 cites·12 claims
- 0457US8846142B2Conductive particle, anisotropic conductive interconnection material that uses the conductive particle, and method for producing the conductive particleAKUTSU YASUSHI·Filed 2010·Granted Sep 30, 2014·0 cites·3 claims
- 0552US8319222B2Adhesive compositionAKUTSU YASUSHI·Filed 2011·Granted Nov 27, 2012·0 cites·7 claims
- 0650US8309224B2Conductive particle, anisotropic conductive interconnection material that uses the conductive particle, and method for producing the conductive particleAKUTSU YASUSHI·Filed 2008·Granted Nov 13, 2012·0 cites·7 claims
- 0736US9515042B2Anisotropic conductive film, connection structure and method of producing the sameAKUTSU YASUSHI·Filed 2011·Granted Dec 6, 2016·0 cites·9 claims
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