Assignee
ALCHIMER
FR·7 granted patents·2 pending applications·9 citations·filing 2005–2014
Top patents by PatentIndex Score
9 records- 0181US7579274B2Method and compositions for direct copper plating and filing to form interconnects in the fabrication of semiconductor devicesALCHIMER·Filed 2007·Granted Aug 25, 2009·9 cites·17 claims
- 0254US10472726B2Electrolyte and process for electroplating copper onto a barrier layerALCHIMER·Filed 2013·Granted Nov 12, 2019·0 cites·25 claims
- 0353US7956099B2Modification process for polymer surfaces, notably for hydroxylation of polymer surfaces and products so obtainedALCHIMER·Filed 2006·Granted Jun 7, 2011·0 cites·17 claims
- 0446US7968653B2Modification process for polymer surfaces, notably for hydroxylation of polymer surfaces and products so obtainedALCHIMER·Filed 2006·Granted Jun 28, 2011·0 cites·14 claims
- 0546US2007062817A1Method of coating a surface of a substrate with a metal by electroplatingALCHIMER·Filed 2005·Application pending·0 cites
- 0645US2007062818A1Electroplating composition intended for coating a surface of a substrate with a metalALCHIMER·Filed 2005·Application pending·0 cites
- 0744US9564333B2Method for forming a metal silicide using a solution containing gold ions and fluorine ionsALCHIMER·Filed 2014·Granted Feb 7, 2017·0 cites·19 claims
- 0841US10460945B2Machine suitable for plating a cavity of a semi-conductive or conductive substrate such as a through via structureALCHIMER·Filed 2012·Granted Oct 29, 2019·0 cites·29 claims
- 0934US10011914B2Copper electrodeposition bath containing an electrochemically inert cationALCHIMER·Filed 2014·Granted Jul 3, 2018·0 cites·10 claims
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