Assignee
ALLISON WILLIAM C
US·7 granted patents·4 pending applications·77 citations·filing 2006–2015
Top patents by PatentIndex Score
11 records- 0197US9211628B2Polishing pad with concentric or approximately concentric polygon groove patternALLISON WILLIAM C·Filed 2011·Granted Dec 15, 2015·21 cites·19 claims
- 0297US9067297B2Polishing pad with foundation layer and polishing surface layerALLISON WILLIAM C·Filed 2011·Granted Jun 30, 2015·31 cites·82 claims
- 0394US8920219B2Polishing pad with alignment apertureALLISON WILLIAM C·Filed 2011·Granted Dec 30, 2014·13 cites·17 claims
- 0488US8439994B2Method of fabricating a polishing pad with an end-point detection region for eddy current end-point detectionALLISON WILLIAM C·Filed 2010·Granted May 14, 2013·8 cites·24 claims
- 0579US8628384B2Polishing pad for eddy current end-point detectionALLISON WILLIAM C·Filed 2010·Granted Jan 14, 2014·3 cites·11 claims
- 0666US8657653B2Homogeneous polishing pad for eddy current end-point detectionALLISON WILLIAM C·Filed 2010·Granted Feb 25, 2014·1 cites·12 claims
- 0762US9028302B2Polishing pad for eddy current end-point detectionALLISON WILLIAM C·Filed 2013·Granted May 12, 2015·0 cites·10 claims
- 0859US2015273656A1Polishing pad with foundation layer and polishing surface layerALLISON WILLIAM C·Filed 2015·Application pending·0 cites
- 0958US2016023322A1Polishing pad with concentric or approximately concentric polygon groove patternALLISON WILLIAM C·Filed 2015·Application pending·0 cites
- 1052US2006183412A1Polishing padALLISON WILLIAM C·Filed 2006·Application pending·0 cites
- 1145US2015343595A1Soft polishing pad for polishing a semiconductor substrateALLISON WILLIAM C·Filed 2015·Application pending·0 cites
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