Assignee
ALPHA DESIGN CO LTD
JP·3 granted patents·10 citations·filing 2008–2014
Top patents by PatentIndex Score
3 records- 0176US8915418B2Electronic component bonding methodALPHA DESIGN CO LTD·Filed 2014·Granted Dec 23, 2014·5 cites·13 claims
- 0243US8875977B2Element pressing apparatus and heating system using element pressing apparatusALPHA DESIGN CO LTD·Filed 2014·Granted Nov 4, 2014·0 cites·5 claims
- 0340USD604132SStaplerALPHA DESIGN CO LTD·Filed 2008·Granted Nov 17, 2009·5 cites·1 claims
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