Assignee
ALPHA METALS
US·18 granted patents·12 pending applications·511 citations·filing 1974–2018
Top patents by PatentIndex Score
30 records- 0190US5955141AProcess for silver plating in printed circuit board manufactureALPHA METALS·Filed 1997·Granted Sep 21, 1999·65 cites·36 claims
- 0289US5879808AParylene polymer layersALPHA METALS·Filed 1997·Granted Mar 9, 1999·113 cites·54 claims
- 0386US6194788B1Flip chip with integrated flux and underfillALPHA METALS·Filed 1999·Granted Feb 27, 2001·77 cites·9 claims
- 0482US6440647B1Resist stripping processALPHA METALS·Filed 2000·Granted Aug 27, 2002·21 cites·20 claims
- 0582US6319543B1Process for silver plating in printed circuit board manufactureALPHA METALS·Filed 1999·Granted Nov 20, 2001·53 cites·25 claims
- 0670US6051276AInternally heated pyrolysis zoneALPHA METALS·Filed 1997·Granted Apr 18, 2000·32 cites·50 claims
- 0767US9566668B2Flux formulationsALPHA METALS·Filed 2013·Granted Feb 14, 2017·1 cites·14 claims
- 0866US2018290244A1High Impact Solder Toughness AlloyALPHA METALS·Filed 2018·Application pending·0 cites
- 0962US6017983AColor indicator for completion of polymerization for thermosetsALPHA METALS·Filed 1998·Granted Jan 25, 2000·22 cites·25 claims
- 1062US2017136583A1High Impact Solder Toughness AlloyALPHA METALS·Filed 2017·Application pending·0 cites
- 1161US6294220B1Post-treatment for copper on printed circuit boardsALPHA METALS·Filed 1999·Granted Sep 25, 2001·25 cites·14 claims
- 1261US4086179AImproved cleaning solvent containing non-azeotropic mixtures of 1,1,1-trichloroethane and n-propanolALPHA METALS·Filed 1976·Granted Apr 25, 1978·10 cites·2 claims
- 1361US2014186524A1Solvent systems for metals and inksALPHA METALS·Filed 2013·Application pending·0 cites
- 1460US6123024AStencil incorporating electronic tagALPHA METALS·Filed 1999·Granted Sep 26, 2000·22 cites·11 claims
- 1559US2016214213A1High impact solder toughness alloyALPHA METALS·Filed 2015·Application pending·0 cites
- 1659US2016144462A1High impact solder toughness alloyALPHA METALS·Filed 2015·Application pending·0 cites
- 1757US6323062B1Wafer coating method for flip chipsALPHA METALS·Filed 1999·Granted Nov 27, 2001·27 cites·14 claims
- 1857US2015266137A1Lead-free and antimony-free tin solder reliable at high temperaturesALPHA METALS·Filed 2013·Application pending·0 cites
- 1957US2018072573A1Production of GrapheneALPHA METALS·Filed 2016·Application pending·0 cites
- 2055US3973572ASelf-purging apparatus for determining the quantitative presence of derived ionsALPHA METALS·Filed 1974·Granted Aug 10, 1976·17 cites·7 claims
- 2155US2016107267A1Solder alloyALPHA METALS·Filed 2015·Application pending·0 cites
- 2253US2016023309A1Lead-free and antimony-free tin solder reliable at high temperaturesALPHA METALS·Filed 2015·Application pending·0 cites
- 2352US3945556AFunctional alloy for use in automated soldering processesALPHA METALS·Filed 1975·Granted Mar 23, 1976·11 cites·5 claims
- 2450US9355938B2Conductive compositions and methods of using themALPHA METALS·Filed 2013·Granted May 31, 2016·0 cites·1 claims
- 2550US2016271738A1Lead-Free, Silver-Free Solder AlloysALPHA METALS·Filed 2014·Application pending·0 cites
- 2644US4009816AMethod and apparatus for increasing efficiency of a foam fluxer used in wave soldering of printed wiring boardsALPHA METALS·Filed 1975·Granted Mar 1, 1977·11 cites·7 claims
- 2733US2014328039A1Systems and methods for void reduction in a solder jointALPHA METALS·Filed 2012·Application pending·0 cites
- 2832US2017135227A1Engineered Residue Solder Paste TechnologyALPHA METALS·Filed 2015·Application pending·0 cites
- 2924US6096808ASnap cure adhesive based on anhydride/epoxy resinsALPHA METALS·Filed 1998·Granted Aug 1, 2000·0 cites·14 claims
- 3018US6158339AStencil holder assembly for use with solder paste stencil printersALPHA METALS·Filed 1999·Granted Dec 12, 2000·4 cites·11 claims
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